Minsk Research Institute of Radiomaterials of the National Academy of Sciences of Belarus offers consumers services for the laser cutting of ceramic materials under an outsourcing agreement or subcontract.

OJSC "Minsk Research Institute of Radiomaterials" of the National Academy of Sciences of Belarus is equipped with a modern EM-250K laser cutting machine designed for cutting through contours and holes in ceramic materials such as 22XC, aluminum nitride, polycor, other types of aluminum oxide ceramics, as well as materials such as Green Tape, LTCC using a solid-state quasi-continuous laser with a wavelength of 1.06 microns.

EM-250K laser cutting machine provides the possibility of obtaining laser marking (engraving) on the surface of the workpiece being processed. The process has a high repeatability due to the stabilization of the water temperature of the cooled laser circuit and the temperature correction of the positioning system of the machine.

Processing is carried out by moving the plate relative to a stationary laser beam. The diameter (d) of the minimum cut-out hole depends on the thickness of the plate(S) and must satisfy the ratio d = 0.1 S, but not less than 50 microns for raw Green Tape and not less than 100 microns for pressed ceramics and polycor.

Technical specifications:

Parameter	Meaning
Laser type	Diode-pumped Nd:YAG
Average power, W	10-25
Processing field, mm	150 х 150
Accuracy, µm/s	5
Thickness of the processed plate, mm	up to 3
XY coordinate table movement error, mm	0,010
Minimum discreteness XY, mm	0,001
Linear movement speed, mm/s	up to 400
Rotation by angle, °	360
Power supply and power consumption	230 V, 50 Hz, 6.5 kW
Overall dimensions, mm	1870x840x1300
Weight, kg	600

Area of application: microelectronics.

OJSC "Minsk Research Institute of Radiomaterials" offers partners services for the laser cutting of ceramic materials under an outsourcing agreement or subcontract.

Link on the Minsk Research Institute of Radiomaterials site.

Laser cutting machine EM-250K is similar to products of companies:
«ENITEC Technology Co., Ltd.» (China);
«Suzhou Chanxan Laser Technology Co., Ltd.» (China);
«Chuangwei Electronic» (China);
«LPKF Laser&Electronics» (USA).

The specialization of the institute includes the following main areas:
* development and production of the element base and functional units of microwave technology (solid-state microwave monolithic integrated circuits - low-noise amplifiers and power amplifiers, protective devices, switches, attenuators, frequency converters; microwave modules, etc.);
* development and production of optoelectronic components and modules based on them (photodetectors, light emitting diodes, semiconductor lasers, receiving and transmitting optical modules);
* production of materials for semiconductor production - gallium arsenide substrates of the "epi-ready" standard;
* development of sensor technology, modules and systems (sensors for inclination, pressure, acceleration, electronic compass, etc.);
* development and production of medical equipment.

The research and production base of the institute includes dedicated equipment which allows to develop and perform a full cycle of technological operations for the manufacture of microwaves, optoelectronic components, sensors of physical quantities based on microelectromechanical systems, equipment for the manufacture of medical products - Glucosen sensors etc. In particular, the equipment allows cutting semiconductor ingots of A3B5 compounds (GaAs, InP, GaN, etc.), grinding and polishing wafers, epitaxial growth, thermal diffusion and implantation of dopants, microcircuit packaging, control of their parameters, etc.

The Institute has a licensed software for electrodynamic calculations, its own library of standard elements, methods for monitoring and testing microwave components in the C, S, L, X, K wavelength ranges, electronic lithography equipment with a resolution of 100 nm, which provides a modern level of design standards.

As part of the specialization, the development of technologies, components and devices for various radio-electronic systems is carried out: radar systems, fiber-optic communication lines, laser rangefinders, systems for leveling and orientation of objects, control systems, guidance and navigation, etc.

Consumers are interested in purchasing services for the laser cutting of ceramic materials under an outsourcing agreement or subcontract.